Foamable phenolic resin composition and process for preparation

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Cellular products or processes of preparing a cellular...

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Details

521 841, 521 88, 521114, 521181, C08J 900

Patent

active

051379317

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a foaming phenolic resin composition used for the production of an acid-curing phenolic resin foam utilized mainly for a refractory heat-insulating material for construction, and a process for the preparation of this foaming phenolic resin composition.


BACKGROUND ART

A phenolic resin foam is low fuming and generates very little poisonous gas, and further, this foam has an excellent flame resistance and heat resistance. Accordingly, the phenolic resin foam has recently attracted attention as a refractory heat-insulating material in the fields of construction materials and ordinary industrial materials.
Nevertheless, as is well known, since the cell membrane defining cells in the phenolic resin foam is brittle and easily broken, during or after the production of the foam, the blowing agent is dissipated from the cells, resulting in a lowering of the heat-insulation thereof.
To overcome this defect, the inventors previously proposed a phenolic resin foam formed by foaming and curing a composition comprising a liquid phenolic resin, an acidic curing agent, a blowing agent, foam stabilizer and a saccharide (see Japanese Patent Publication No. 61-238833).
The phenolic resin foam disclosed in the above patent publication is superior to the conventional phenolic resin foam from the viewpoint of the resistance to brittleness (friability), heat-insulation and stability (at normal temperature), but if the density- is reduced to reduce the weight and cost of the foam or the foam is placed in an environment wherein violent changes in the temperature occur, the heat-insulation is adversely affected, and because of this defect, the use of the foam is considerably restricted.
Therefore, a primary object of the present invention is to provide a foamable phenolic resin composition suitable for the production of a phenolic resin foam wherein the heat-insulation is not substantially influenced by the reduction of the density or changes of the ambient temperature, while the characteristics of the invention of Japanese Patent Publication No. 61-238833 are retained, and a process for the preparation of this foamable phenolic resin composition.


DISCLOSURE OF THE INVENTION

The inventors made an investigation with a view to overcoming the above-mentioned defect, and as a result, found that if a partial or complete acetylation product of a specific castor oil/ethylene oxide adduct is used as a foam stabilizer and/or a resol type liquid phenolic resin in which the residual amount of a catalyst having a metal ion-forming capacity adjusted below a specific level, the above-mentioned object can be attained. It also was found that a treatment with a weakly acidic cation exchange resin is especially effective as an industrial means of removing the catalyst contained in the resol type liquid phenolic resin. The present invention has now been completed based on these findings.
More specifically, in accordance with the present invention, there is provided a foamable phenolic resin composition comprising as indispensable components a resol type liquid phenolic resin, an acidic curing agent, (a blowing agent) a saccharide and a foam stabilizer, wherein a partial or complete acetylation product of a castor oil/ethylene oxide adduct having a hydroxyl value smaller than 15 mg-KOH/g, which is obtained by acetylating a castor oil/ethylne oxide adduct formed by adding 20 to 70 moles of ethylene oxide to 1 mole of castor oil, is used as the foam stabilizer, and/or a resol type liquid phenolic resin obtained by subjecting a phenol and an aldehyde to addition condensation reaction in the presence of a catalyst having a metal ion-forming capacity, in which the residual amount of the catalyst is smaller than 0.1 part by weight as calculated as the metal element per 100 parts by weight of solids of the resol type liquid phenolic resin, is used as the resol type liquid phenolic resin.
Furthermore, in accordance with the present invention, there is provided a process for the preparation of a foamable p

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