Plastic and nonmetallic article shaping or treating: processes – Recycling of reclaimed or purified process material – Of gaseous process material
Patent
1992-09-04
1994-03-08
Kuhns, Allan R.
Plastic and nonmetallic article shaping or treating: processes
Recycling of reclaimed or purified process material
Of gaseous process material
264109, 264337, 264DIG69, B29B 1700
Patent
active
052924629
ABSTRACT:
This relates to a mold for rebonding polyurethane and like plastic foam to form selected shapes. A typical shape may be a back or a seat member for an article of furniture. The mold is improved in that the bottom mold member, which is particularly designed in accordance with the desired configuration of the shape, has been formed of epoxy which is readily moldable at a low cost. The mold is also improved by providing the base plate of the mold with a ramped floor which facilitates the drainage of condensate from a lower steam chamber. The configuration of the ramped floor allows for quick removal of the condensate and serves to reduce the volume in the steam chamber thereby minimizing pressure build-up in the steam chamber. This results in lower steam pressures being used during the curing process and for a shorter curing operation. The lower steam pressure also avoids leakage of steam and water from the epoxy mold.
REFERENCES:
patent: 2332314 (1943-10-01), Haley
patent: 3726624 (1973-04-01), Schwarz
patent: 3847720 (1974-11-01), Laberinti
patent: 4243617 (1981-01-01), Burge
patent: 4379106 (1983-04-01), Bussey, Jr.
patent: 4454081 (1984-06-01), Soulier
patent: 4591469 (1986-05-01), Buchanan et al.
patent: 5102589 (1992-04-01), Chond et al.
Herman Miller Inc.
Kuhns Allan R.
LandOfFree
Foam-rebonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Foam-rebonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Foam-rebonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-151187