Foam printed circuit substrates

Details Foam printed circuit substrates Foam printed circuit substrates

1994-12-12

1996-07-30

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174254, 361750, 361748, 29831, 29829, H05K 100

Patent

active

055413668

ABSTRACT:
A printed circuit board having foamed substrates of low dielectric constant and low dissipation factor and techniques for making printed circuit boards and printed circuits using such substrates. The substrate has a dielectric constant less than 1.5 and a dissipation factor less than 10.sup.-2, most preferably, polymethylacrylimide. A conductive layer is placed on the substrate surface using chemical deposition or by use of appropriate adhesives. The printed circuit may be imprinted by conventional techniques such as etching with appropriate etching materials.

REFERENCES:
patent: 3222442 (1965-12-01), Parker et al.
patent: 4062750 (1977-12-01), Butler
patent: 4329779 (1982-05-01), England
patent: 4403107 (1983-09-01), Hoffman
patent: 4708281 (1987-11-01), Nelson et al.
patent: 4870429 (1989-09-01), Fujita et al.
patent: 4937585 (1990-06-01), Shoemaker
patent: 5061943 (1991-10-01), Rammos
patent: 5313015 (1994-05-01), Hoge

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