Foam backing for use with semiconductor wafers

Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

51283R, 51125, B24B 700

Patent

active

051016028

ABSTRACT:
A backing pad be used in a holding jig for holding a semiconductor wafer in the step of mirror polishing comprises a hydrophobic foam, possessed rigidity such that the difference between the thickness, T.sub.1, thereof under a load of 300 gf/cm.sup.2 and the thickness, T.sub.2, thereof under a load of 1,800 gf/cm.sup.2, (T.sub.1 -T.sub.2), is in the range of from 1 to 100 .mu.m, and has holes formed therein in a diameter in the range of 10 to 30 .mu.m through the wafer-holding surface thereof.
The polishing of a semiconductor is effected by a method which comprises preparing a finished backing pad by the precision surface machining operation, setting the semiconductor wafer on a wafer holding jig having a template containing at least one wafer-positioning hole fixed on a carrier plate in such a manner that the backing pad enters the positioning hole, and polishing the semiconductor wafer.

REFERENCES:
patent: 3924362 (1975-12-01), McAleer
patent: 4893436 (1990-01-01), Rich

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Foam backing for use with semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Foam backing for use with semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Foam backing for use with semiconductor wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1886846

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.