Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool
Patent
1991-04-19
1992-04-07
Kisliuk, Bruce M.
Abrasive tool making process, material, or composition
Impregnating or coating an abrasive tool
51283R, 51125, B24B 700
Patent
active
051016028
ABSTRACT:
A backing pad be used in a holding jig for holding a semiconductor wafer in the step of mirror polishing comprises a hydrophobic foam, possessed rigidity such that the difference between the thickness, T.sub.1, thereof under a load of 300 gf/cm.sup.2 and the thickness, T.sub.2, thereof under a load of 1,800 gf/cm.sup.2, (T.sub.1 -T.sub.2), is in the range of from 1 to 100 .mu.m, and has holes formed therein in a diameter in the range of 10 to 30 .mu.m through the wafer-holding surface thereof.
The polishing of a semiconductor is effected by a method which comprises preparing a finished backing pad by the precision surface machining operation, setting the semiconductor wafer on a wafer holding jig having a template containing at least one wafer-positioning hole fixed on a carrier plate in such a manner that the backing pad enters the positioning hole, and polishing the semiconductor wafer.
REFERENCES:
patent: 3924362 (1975-12-01), McAleer
patent: 4893436 (1990-01-01), Rich
Kisliuk Bruce M.
Morgan Eileen P.
Shin-Etsu Handotai & Co., Ltd.
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