Fluxless soldering process using a silane atmosphere

Details Fluxless soldering process using a silane atmosphere Fluxless soldering process using a silane atmosphere

1985-10-31

1987-03-03

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228220, B23K 120, H01L 2198

Patent

active

046469583

ABSTRACT:
Solder reflow or solder chip joining can be accomplished in a fluxless system by conducting the solder reflow or chip joining procedure in a carrier gas which comprises from about 0.1 to about 10% by volume SiH.sub.4, based on the volume of carrier gas and SiH.sub.4. A preferred carrier gas for the reflow is hydrogen and a preferred carrier gas for the chip joining is nitrogen.

REFERENCES:
patent: 3012903 (1961-12-01), Cape
patent: 3665590 (1972-05-01), Percival
patent: 3754698 (1973-08-01), Bochinski et al.
patent: 4576659 (1986-03-01), Lewis et al.

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