Fluxless soldering process

Details Fluxless soldering process Fluxless soldering process

1989-03-15

1990-05-01

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281802, 228220, 228221, 204170, B23K 120, B23K 3538

Patent

active

049211579

ABSTRACT:
A method of soldering without the need for fluxing agents, high temperature, hydrogen, laser excitation or sputtering techniques. The method uses plasma excitation to remove surface oxides from solder surfaces, thereby eliminating the need for post-soldering cleaning in an accurate and efficient manner, resulting in a higher quality and long term reliability solder joint. In addition, serious environmental problems caused by cleaning solvents are avoided.

REFERENCES:
patent: 4081121 (1978-03-01), Picard
patent: 4405379 (1983-09-01), Chasteen
patent: 4498046 (1985-02-01), Faris et al.
patent: 4504007 (1985-03-01), Anderson, Jr. et al.
patent: 4577398 (1986-03-01), Sliwa et al.
Genieys, E., British Association for Brazing and Soldering, "Brazing in Reducing Fluoride Containing Atmospheres", London, Nov. 1972.
IBM Technical Disclosure Bulletin, vol. 27, No. 11, Apr. 1985--"Dry Soldering Process Using Halogenated Gas".
Moskowitz and Yeh, "Thermal Dry Process Soldering", J. Vac. Sci. Technol. A, vol. 4, No. 3, May/Jun. 1986.
Moskowitz and Davidson, "Summary Abstract: Laser--Assisted Dry Process Soldering", J. Vac. Sci. Technol. A., vol. 3, No. 3, May/Jun. 1985.

Affiliated with

Also associated with

Rating

Fluxless soldering process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluxless soldering process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluxless soldering process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-824872