Fluxless soldering of copper

Details Fluxless soldering of copper Fluxless soldering of copper

1993-11-19

1995-04-18

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228254, 22826261, 427123, B23K 120

Patent

active

054071216

ABSTRACT:
A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmospheric pressure and in an inert or oxidizing atmosphere using standard solder reflow equipment.

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Genieys, E., British Association for Brazing and Soldering, "Brazing in Reducing Fluoride Containing Atmospheres", London, Nov. 1972.
IBM Technical Disclosure Bulletin, vol. 27, No. 11, Apr. 1985--"Dry Soldering Process Using Halogenated Gas".
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J. Licari and L. Enlow, Hybrid Microcircuit Technology Handbook, Noyes Publications, New Jersey, 1988, p. 235.
C. Mackay, Flux Reactions and Solderability in Solder Joint Reliability, J. Lau-Editor, Van Nostrand Reinhold, N.Y., 1991, pp. 2, 73-80.
H. Manko, Solders and Soldering, McGraw Hill, N.Y., 1992, pp. 380-381, 156-158, 373, 375, 160-161.

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