Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Patent
1995-04-20
1997-03-11
Ramsey, Kenneth J.
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
228211, 228220, B23K 120
Patent
active
056092903
ABSTRACT:
A fluxless soldering method utilizing a strongly internally bonded fluorine containing gas such as hydrogen fluoride (HF). The solder surface is exposed to the gas in place of a flux treatment, resulting in a modified surface layer which allows reflow or joining for an extended period.
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Clavel et al., "Vapor Phase Fluoride-Ion Processing of Jet Engine Superalloy Components", Plating & Surface Finishing, Nov. 1991, pp. 52-57.
Koopman et al., "Fluxless Soldering in Air and Nitrogen", 43rd ECTC Proceedings, 1993 p. 595, Orlando Fl.
Koopman et al., "Fluxless Soldering for Chip-on-Board and Surface Mount", SMTA National Symposium Proceedings, Oct. 1994, p. 55 ff.
Bobbio Stephen M.
DuBois Thomas D.
Geis James D.
Lipscomb Robert F.
Lucey, Jr. George K.
Barber Lynn E.
Ramsey Kenneth J.
The University of North Carolina at Charlotte
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