Fluxless resoldering system and fluxless soldering process

Details Fluxless resoldering system and fluxless soldering process Fluxless resoldering system and fluxless soldering process

1990-06-04

1992-08-18

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228219, 228239, 228240, 228 62, 228 42, B23K 100, B23K 300

Patent

active

051391937

ABSTRACT:
A fluxless reflow soldering processing and system having a reactive inert gas control arrangement coupled to a conventional reflow soldering head for enabling solder to wet metallic surfaces for joining purposes. The gas control arrangement includes a set of gas regulating valves and heat exchange units for supplying selected quantities of inert gases under pressure at various temperatures to a soldering area during the soldering process. The inert gases are employed to clean the soldering area of metal oxides and are used to facilitate the forming of a reliable solder joint by inhibiting the formation of metal oxides and by helping to cool down the solder joint in a substantially uniform manner.

REFERENCES:
patent: 3754698 (1973-08-01), Bochinski et al.
patent: 4979664 (1990-12-01), Lyons et al.

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