Fluxing underfill compositions

Details Fluxing underfill compositions Fluxing underfill compositions

2006-03-07

2006-03-07

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S112000, C525S113000, C525S114000, C525S119000, C525S122000, C525S481000, C525S488000, C525S502000, C525S507000, C525S508000, C525S523000, C525S524000, C525S530000

Reexamination Certificate

active

07009009

ABSTRACT:
A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

REFERENCES:
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5985043 (1999-11-01), Zhou et al.
patent: 5985456 (1999-11-01), Zhou et al.
patent: 5985486 (1999-11-01), Giron
patent: 6458472 (2002-10-01), Konarski et al.
patent: 6706417 (2004-03-01), Konarski et al.
patent: WO 9837134 (1998-08-01), None

Affiliated with

Also associated with

Rating

Fluxing underfill compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluxing underfill compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluxing underfill compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3601992