Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1975-08-14
1976-07-20
Smith, Al Lawrence
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228223, 148 23, 228263, B23K 35362
Patent
active
039702391
ABSTRACT:
A process for removing lead oxide from the surface of the lead solder of a semiconductor assembly in the inert atmosphere of a joining furnace by introducing into the joining furnace an acetate compound capable of reacting with lead oxide at the joining furnace temperature to form a coordinated lead compound. Both the acetate compound and the coordinated lead compound are gases at the joining furnace temperature. The acetate compound is preferably glacial acetic acid, acetic anhydride, or mixtures thereof.
REFERENCES:
patent: 3058210 (1962-10-01), Winters
patent: 3099590 (1963-07-01), Laudenslager
patent: 3412113 (1968-11-01), Fitch et al.
patent: 3665590 (1972-05-01), Percival
patent: 3754698 (1973-08-01), Bochinski et al.
General Instrument Corporation
Ramsey K. J.
Smith Al Lawrence
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