Fluxing media for non-VOC, no-clean soldering

Details Fluxing media for non-VOC, no-clean soldering Fluxing media for non-VOC, no-clean soldering

1998-03-13

2000-05-02

Ryan, Patrick

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228223, B23K 120, B23K 3102

Patent

active

060561890

ABSTRACT:
A flux formulation without a surfactant is available for use in the assembly of electronic circuit boards as a no-clean formulation. The formulation includes a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's). The method includes the steps of heating the flux solution and dispersing it as a fine spray.

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