Flux-removing aqueous cleaning composition and method of use

Details Flux-removing aqueous cleaning composition and method of use Flux-removing aqueous cleaning composition and method of use

1997-05-20

1999-09-28

Gupta, Yogendra

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 39, 510175, 510422, 510423, 510433, 510178, B08B 302, B08B 308, C11D 1825

Patent

active

059581441

ABSTRACT:
A flux-removing, aqueous cleaning composition contains: (A) a solvent phase consisting essentially of water; and (B) a flux-removing phase containing an alkaline salt component and a surfactant formulation, the alkaline salt component containing at least one alkali metal salt, and the surfactant formulation containing at least one fluorinated surfactant and at least one N-alkylpyrrolidone surfactant. A method of removing rosin flux residues from a substrate, preferably a substrate of an electronic circuit assembly, involves (a) cleaning the substrate with the above-described aqueous cleaning composition for a period of time sufficient to substantially emulsify the soldering rosin flux residues to form emulsified rosin flux residues; and (b) removing the emulsified rosin flux residues from the substrate.

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