Flux-free photodetector bonding

Details Flux-free photodetector bonding Flux-free photodetector bonding

1983-11-28

1985-09-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228222, 228228, 228229, H01L 2158, B23K 104

Patent

active

045401152

ABSTRACT:
A method of bonding photodetector devices to heatsinks, which devices can be damaged above 250.degree. C., using a gold-tin eutectic solder which has a melting point of 280.degree. C., is disclosed. The process comprises heating the heatsink and solder past the solder melting point on a quick thermal response heating element, turning off the heating power, and introducing the chip into the liquid solder on the cool down cycle. By controlling the rate at which the heatsink solder and device cool down and the time span from introduction of the chip to solidification of the solder, the chip can be exposed to sufficient heat to provide a good thermal, electrical and physical bond while substantially enhancing the yield of electrically undamaged photodetector chips.

REFERENCES:
patent: 3071854 (1963-01-01), Pighini
patent: 3165818 (1965-01-01), Soffa et al.
patent: 3648357 (1972-03-01), Green, Jr.
patent: 3680196 (1972-08-01), Leinkram
patent: 3883946 (1975-05-01), Dale
patent: 4039116 (1977-08-01), Chaffin, III
patent: 4142662 (1979-03-01), Holbrook et al.

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