Flux for soldering electronic components on circuit substrates,

Metal treatment – Compositions – Fluxing

Patent

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Details

148 23, 148 24, 148 25, 106 113, 228214, 228223, 228224, H05K 306

Patent

active

058633553

ABSTRACT:
The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.

REFERENCES:
patent: 4290824 (1981-09-01), Cole
patent: 5417771 (1995-05-01), Arita et al.

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