Metal treatment – Compositions – Fluxing
Patent
1994-11-03
1995-08-22
Rosenberg, Peter D.
Metal treatment
Compositions
Fluxing
148 24, 148 25, B23K 3534
Patent
active
054436591
ABSTRACT:
Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.
REFERENCES:
patent: 3175933 (1965-03-01), Wasserman
patent: 3840411 (1974-10-01), Rozzi et al.
patent: 4187348 (1980-02-01), Dearlove et al.
patent: 4460414 (1984-07-01), Hwang
M. Kitajima et al., "Clean Soldering with No Residue Flux", Proceedings of the 7th International Microelectronics Conference, Jun. 3-5, 1992, pp. 187-193.
N. Bandyopadhyay et al., "Development of Fluxless Soldering Process for Surface Mount Technology", Soldering and Surface Mount Technology, No. 4, Feb. 1990, pp. 23-26.
Adachi Akira
Fujino Junji
Hayashi Osamu
Morihiro Yoshiyuki
Murakami Kohei
Mitsubishi Denki & Kabushiki Kaisha
Rosenberg Peter D.
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