Flux for solder paste and solder paste

Details Flux for solder paste and solder paste Flux for solder paste and solder paste

2007-07-10

2007-07-10

Jenkins, Daniel (Department: 1742)

Metal treatment

Compositions

Fluxing

Reexamination Certificate

active

10349283

ABSTRACT:
A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can maintain good coating and printing ability for long time, further can endure preheating under high temperatures.

REFERENCES:
patent: 3944123 (1976-03-01), Jacobs
patent: 4113525 (1978-09-01), Stayner et al.
patent: 4960236 (1990-10-01), Hedges et al.
patent: 5150832 (1992-09-01), Degani et al.
patent: 5417771 (1995-05-01), Arita et al.
patent: 5904782 (1999-05-01), Diep-Quang
patent: 5985456 (1999-11-01), Zhou et al.
patent: 6059894 (2000-05-01), Pendse
patent: 6641679 (2003-11-01), Nishina et al.
patent: 1317991 (2003-06-01), None
patent: 06063788 (1994-03-01), None
patent: 3105505 (2000-11-01), None
patent: 2001138089 (2001-05-01), None

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