Flux for solder paste

Details Flux for solder paste Flux for solder paste

2005-04-19

2005-04-19

Jenkins, Daniel (Department: 1742)

Metal treatment

Compositions

Fluxing

C148S024000

Reexamination Certificate

active

06881278

ABSTRACT:
A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.

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