Flux-encased resilient solder preforms and process for the prepa

Details Flux-encased resilient solder preforms and process for the prepa Flux-encased resilient solder preforms and process for the prepa

1997-12-08

1999-11-16

Ryan, Patrick

Metal fusion bonding

Solder form

228224, 148 26, B23K 3514, B23K 3102, B23K 3534

Patent

active

059841613

ABSTRACT:
Relatively resilient flux encasings for solder preforms are obtained when a mixture of 5 to 30 wt. % potassium silicate having a molar ratio of K.sub.2 O:SiO.sub.2 ranging from 1:2.5 to 1:4.5, 0.5 to 10 wt. % concentrated phosphoric acid, 0.1 to 5 wt. % boric acid and 0 to 10 wt. % finely divided silicon dioxide, with the remainder water, is used as the binder.

REFERENCES:
patent: 3663245 (1972-05-01), Bryson
patent: 3804666 (1974-04-01), Eppler et al.
patent: 3840394 (1974-10-01), Eppler
patent: 3922396 (1975-11-01), Speirs et al.
patent: 3925537 (1975-12-01), Bither, Jr.
patent: 3939028 (1976-02-01), Schiffarth et al.
patent: 3962061 (1976-06-01), Nikaido et al.
patent: 3968302 (1976-07-01), Brown
patent: 3977888 (1976-08-01), Sano et al.
patent: 4098610 (1978-07-01), Wexell
patent: 4164610 (1979-08-01), Beall et al.
patent: 4180419 (1979-12-01), Thompson, Jr.
patent: 4235649 (1980-11-01), Inamura et al.
patent: 4298390 (1981-11-01), Flannery et al.
patent: 4415364 (1983-11-01), Naito et al.
patent: 4503158 (1985-03-01), Richard
patent: 5002805 (1991-03-01), Robyn
patent: 5332418 (1994-07-01), Daussan et al.
patent: 5378871 (1995-01-01), Nishikawa et al.
patent: 5610108 (1997-03-01), Watzke et al.
patent: 5674108 (1997-10-01), Rolle
patent: 5690271 (1997-11-01), Dudel
patent: 5789068 (1998-08-01), King et al.

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