Flux effect by microexplosive evaporation

Details Flux effect by microexplosive evaporation Flux effect by microexplosive evaporation

1989-07-20

1991-01-22

Heinrich, Sam

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228223, 148 23, 156629, 156642, 156664, 156666, 156667, B23K 120

Patent

active

049864637

ABSTRACT:
A process for joining the surface of one preferably metallic member to another at a joint, and using solder to create the joint at a joining temperature, includes applying a medium to the joint which evaporates by microexplosion at below the joining temperature. The microexplosive evaporation of the medium advantageously cleans the surfaces of the members and reduces surface tension to allow solder to flow and wet the surfaces. The medium is advantageously glycerin or a mixture of glycerin and detergent so that no residue remains after the joining operation.

REFERENCES:
patent: 2291399 (1942-07-01), Miller
patent: 4244506 (1981-01-01), Stokes, Jr. et al.
patent: 4738732 (1988-04-01), Anderson et al.
IBM Technical Disclosure, "Immersion Wave Soldering Flux", vol. 29, No. 7, p. 3178, 12-1986.

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