Flux composition for solder, solder paste, and method of...

Metal fusion bonding – Process – Plural joints

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S207000, C228S223000, C228S224000, C228S248100

Reexamination Certificate

active

07575150

ABSTRACT:
Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

REFERENCES:
patent: 4140554 (1979-02-01), Stayner et al.
patent: 4278479 (1981-07-01), Anderson et al.
patent: 4960236 (1990-10-01), Hedges et al.
patent: 5064481 (1991-11-01), Davis et al.
patent: 5417771 (1995-05-01), Arita et al.
patent: 5741622 (1998-04-01), Arima
patent: 5932031 (1999-08-01), Hamilton et al.
patent: 5993909 (1999-11-01), Mizutani et al.
patent: 6059894 (2000-05-01), Pendse
patent: 6103387 (2000-08-01), Yamamoto et al.
patent: 6211320 (2001-04-01), Dershem et al.
patent: 6214956 (2001-04-01), Plochocka
patent: 6399277 (2002-06-01), Nojima et al.
patent: 6403670 (2002-06-01), Ishidoya et al.
patent: 6599372 (2003-07-01), Arora et al.
patent: 6617046 (2003-09-01), Noro et al.
patent: 6667194 (2003-12-01), Crane et al.
patent: 7009009 (2006-03-01), Crane et al.
patent: 2002/0151106 (2002-10-01), Noro et al.
patent: 2003/0082355 (2003-05-01), Iwaida et al.
patent: 2003/0219619 (2003-11-01), Noro et al.
patent: 2004/0048950 (2004-03-01), Nishida et al.
patent: 2004/0129344 (2004-07-01), Arita et al.
patent: 2004/0170587 (2004-09-01), Vondruska
patent: 2005/0032946 (2005-02-01), Salvin et al.
patent: 2006/0019077 (2006-01-01), Hopper et al.
patent: 2006/0272747 (2006-12-01), Wang et al.
patent: 2007/0095432 (2007-05-01), Musa
patent: 2007/0240792 (2007-10-01), Witteler et al.
patent: 2007/0277907 (2007-12-01), Musa
patent: 2008/0023108 (2008-01-01), Wang et al.
patent: 1059323 (2000-12-01), None
patent: 2025291 (1990-01-01), None
patent: 2290693 (1990-11-01), None
patent: 05-212584 (1993-08-01), None
patent: 07-164183 (1995-06-01), None
patent: 10-305391 (1998-11-01), None
patent: 2004-042786 (2000-02-01), None
patent: 2001239395 (2001-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flux composition for solder, solder paste, and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flux composition for solder, solder paste, and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flux composition for solder, solder paste, and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4135078

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.