Flux composition and method of decreasing tin content in lead/ti

Details Flux composition and method of decreasing tin content in lead/ti Flux composition and method of decreasing tin content in lead/ti

1988-10-17

1990-01-30

Seidel, Richard K.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228223, 228207, 148 23, 75 78, 75 93R, B23K 35363

Patent

active

048968170

ABSTRACT:
A technique for soldering is provided wherein the solder contains a nominal amount of 4 to 5% tin and the remainder lead. A solder flux is utilized which incorporates a lead compound, such as lead acetate. When the solder and flux is heated, a redox reaction will take place in which the lead ions in the flux will replace the alloyed tin in the solder, thereby reducing the tin content of the solder, whereby the ductility of the solder joint is improved.

REFERENCES:
patent: 2097560 (1937-11-01), Butcher
patent: 2115299 (1938-04-01), Butcher
patent: 2235423 (1941-03-01), Erickson
patent: 3970239 (1976-07-01), Hill
patent: 4165244 (1979-08-01), Jacobs
patent: 4274483 (1981-06-01), Cottone et al.
patent: 4332343 (1982-06-01), Koopman et al.
patent: 4360392 (1982-11-01), Roberts

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