Flux composition and corresponding soldering method

Details Flux composition and corresponding soldering method Flux composition and corresponding soldering method

1995-05-05

1996-07-02

Silverberg, Sam

Metal treatment

Compositions

Fluxing

148 24, B23K 3534

Patent

active

055318380

ABSTRACT:
A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

REFERENCES:
patent: 3424625 (1969-01-01), Tiegel
patent: 4940498 (1990-07-01), Rubin
patent: 4988395 (1991-01-01), Taguchi et al.
patent: 5004509 (1991-04-01), Bristol
patent: 5215601 (1993-06-01), Gomi et al.
patent: 5281281 (1994-01-01), Stefanowski
patent: 5334260 (1994-08-01), Stefanowski
patent: 5443660 (1995-08-01), Gao et al.

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