Flux composition and corresponding soldering method

Metal treatment – Compositions – Fluxing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148 24, B23K 3534

Patent

active

055318380

ABSTRACT:
A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

REFERENCES:
patent: 3424625 (1969-01-01), Tiegel
patent: 4940498 (1990-07-01), Rubin
patent: 4988395 (1991-01-01), Taguchi et al.
patent: 5004509 (1991-04-01), Bristol
patent: 5215601 (1993-06-01), Gomi et al.
patent: 5281281 (1994-01-01), Stefanowski
patent: 5334260 (1994-08-01), Stefanowski
patent: 5443660 (1995-08-01), Gao et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flux composition and corresponding soldering method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flux composition and corresponding soldering method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flux composition and corresponding soldering method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1503154

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.