Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1994-05-31
1997-04-01
Beck, Shrive
Metal fusion bonding
Process
With protecting of work or filler or applying flux
427 96, 22818021, 29840, 106311, 361743, 361767, 361808, 148 25, B05D 512, B23K 120
Patent
active
056158270
ABSTRACT:
A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
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Arldt Roy L.
Downey Susan H.
Golden Harry J.
Mahmoud Issa S.
Okoro Clement A.
Beck Shrive
International Business Machines - Corporation
Talbot Brian K.
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