Flux cleaning for flip chip technology using environmentally fri

Details Flux cleaning for flip chip technology using environmentally fri Flux cleaning for flip chip technology using environmentally fri

1998-03-17

1999-11-23

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228201, 228202, 228 19, B23K 1018

Patent

active

059884851

ABSTRACT:
A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.

REFERENCES:
patent: 5181648 (1993-01-01), Leicht
R. G. Christensen et al., "Flux Removal Tool," IBM Tech. Discl. Bull., vol. 19, No. 9, pp. 3395-3396, Feb. 1977.

Affiliated with

Also associated with

Rating

Flux cleaning for flip chip technology using environmentally fri does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flux cleaning for flip chip technology using environmentally fri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flux cleaning for flip chip technology using environmentally fri will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1211782