Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-05-06
1992-09-22
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29856, 156285, 156293, 26427215, B29C 6548
Patent
active
051493870
ABSTRACT:
Flush mounting of a sensor on a surface is provided by first forming a recessed area on the surface. Next an adhesive bonding mixture is introduced into the recessed area. The adhesive bonding mixture is chosen to provide thermal expansion matching with the surface surrounding the recessed area. A strip of high performance polymeric tape is provided, with the sensor attached to the underside thereof, and the tape is positioned over the recessed area so that it acts as a carrier of the sensor. A shim having a flexibility so that it will conform to the surface surrounding the recessed area is placed over the tape, and a vacuum pad is placed over the shim. The area above the surface is then evacuated while holding the sensor flush with the surface during curing of the adhesive bonding mixture. After such curing, the pad, shim, and tape are removed from the sensor, electrical connections for the sensor are provided, after which the remaining space in the recessed area is filled with a polymeric foam.
REFERENCES:
patent: 3428933 (1969-02-01), Gerstenberger
patent: 3554834 (1971-01-01), Bennett et al.
patent: 4329779 (1982-05-01), England
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patent: 4554036 (1985-11-01), Newsom
patent: 4864724 (1989-09-01), Bergstrom
Gureev, "Method of Protecting Strain Gauges (Exchange of Experience", Ind. Lab (USA) vol. 43, No. 1 (Jan. 1977) (Publ. Jul. 1977) 73-775.
Administrator of the National Aeronautics and Space Administrati
Ball Michael W.
Helfrich George F.
Maki Steven D.
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