Fluorinated polymeric composition, fabrication thereof and use t

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428209, 428323, 428421, 428422, 428901, 361397, 361398, 427 96, 525235, 525935, 525936, B32B 300

Patent

active

050553429

ABSTRACT:
Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.

REFERENCES:
patent: 3787281 (1974-01-01), Effenberger
patent: 4134848 (1979-01-01), Adicoff et al.
patent: 4238641 (1980-12-01), Planting et al.
patent: 4241132 (1980-12-01), Pratt et al.
patent: 4268337 (1981-05-01), Ibata et al.
patent: 4335180 (1982-06-01), Traut
patent: 4405543 (1983-09-01), Murphy et al.
patent: 4431698 (1984-02-01), Case et al.
patent: 4447565 (1984-05-01), Lula et al.
patent: 4610495 (1986-09-01), Landi
patent: 4634631 (1987-01-01), Gazit et al.
patent: 4640866 (1987-02-01), Suzuki
patent: 4661301 (1987-04-01), Okada et al.
patent: 4680220 (1987-07-01), Johnson
patent: 4788230 (1988-11-01), Mudge
patent: 4818619 (1989-04-01), Strepparola et al.
patent: 4849284 (1989-07-01), Arthur et al.
patent: 4886699 (1989-12-01), Carroll et al.
Haining et al., "Low Dielectric Constant Material for Printed Circuit Boards", IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979.
Katz et al., "Handbook of Fillers for Plastics," Chapter 21, Solid Spherical Fillers, pp. 429-452, Van Nostrand Reinhold Company.
Chandrashekhar et al., "Fabrication of Printed Circuit Wiring Boards Using Insulation Layers with Low Dielectric Constant," IBM Technical Disclosure Bulletin, vol. 31, No. 7, Dec. 1983, pp. 25-26.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fluorinated polymeric composition, fabrication thereof and use t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluorinated polymeric composition, fabrication thereof and use t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluorinated polymeric composition, fabrication thereof and use t will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-256270

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.