Fluorinated fluxless soldering

Details Fluorinated fluxless soldering Fluorinated fluxless soldering

1995-05-12

1997-04-01

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228220, 438706, H05K 334

Patent

active

056158254

ABSTRACT:
A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder surface to reduce or eliminate or chemically convert the surface oxides. The process can take place at atmospheric pressure and room temperature. A simple belt driven transport may be used to move the parts past a nozzle which emits the vapor in a system similar to a conventional solder reflow machine.

REFERENCES:
patent: 4646958 (1987-03-01), Howard, Jr.
patent: 4821947 (1989-04-01), Nowotarski
patent: 4919729 (1990-04-01), Elmgren et al.
patent: 4921157 (1990-05-01), Dishon et al.
patent: 4937006 (1990-06-01), Bickford et al.
P.A. Moskowitz, et al., Summary Abstract: Laser-Assisted Dry Processing Soldering, J. Vac. Sci. Tech. 3 (May/Jun., 1985).
Dry Soldering Process Using Halogenated Gas, dated Apr., 1985, IBM Techical Disclosure Bulletin, Vol. 27, No. 11, p. 6513.
P.A. Moskowitz, et al., Thermal Dry Process Soldering, J. Vac. Sci. Tech. 4 (May/Jun., 1986), pp. 838-840.

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