Chemistry: analytical and immunological testing – Synthetic or natural resin
Patent
1987-12-11
1989-12-05
Lacey, David L.
Chemistry: analytical and immunological testing
Synthetic or natural resin
436 34, 436 56, 436172, 436903, 534588, 534689, G01N 3344
Patent
active
048852546
ABSTRACT:
A method for determining the extent of polymerization of a polymer system consisting of adding a fluorescent label, the label having a reactivity similar to the reactivity of the curing agent, to the polymer system and measuring the fluorescence intensity proportional to cure species concentration during polymerization. The fluorescence intensity of the label exhibits sensitive changes throughout the polymerization process, allowing one to follow cure reactions in a quantitive way by measuring fluorescence, especially in the latter stages of cure. The cure species composition, reactivity ratio, activation energy and weight-average molecular weight can also be determined by adding a label and measuring the UV-VIS spectra in addition to the fluorescence intensity. Reaction of the label with the monomer produces spectrophotometric shifts which are deconvoluted based on the band assignments of model compounds to obtain compositional analy
REFERENCES:
patent: 4543335 (1985-09-01), Sommers et al.
patent: 4717674 (1988-01-01), Sung
I. J. Chin and C. S. P. Sung, Macromolecules, 17:2603-2607 (1984).
I. J. Chin and C. S. P. Sung, Polymer Preprints, 25(2):199-200 (1984).
C. S. P. Sung et al., Polymer Preprints, 27(2): (1986).
C. S. P. Sung et al., Macromolecules, 19:2922-2932 (1986).
M. K. Antoon et al., Polym. Comp., 2:81 (1981).
"Isothermal Cure Kinetics of an Epoxy Resin Prepreg" by G. L. Hagnauer et al., ACS Symp. Ser. 221, 229-244 (1983).
"SEC Analysis of Epoxy Resin Cure Kinetics", by G. L. Hagnauer et al., ACS Symp. Ser. 227, 25 (1983).
"Effects of Impurities on Hydrolytic Stability & Curing Behavior", by Hagnauer et al., ACS Symp. Ser. 221, 193-209 (1983).
"Microdielectrometry: A New Method for In Situ Cure Monitoring", by N. F. Sheppard et al., Proc. of the 26th SAMPE Symp., Los Angeles 65 (1981).
"Torsional Braid Analysis", by John B. Enns & John K. Gilliam, Am. Chem. Society, Advances in Chem. Series, #203, 1983, Ch. 2, 27-63 (1983).
"Some Molecular Motions in Epoxy Polymers: A C Solid-State NMR Study" by A. N. Garroway et al., Macromolecules, 15: 1051-1063 (1982).
"Studies of Epoxy Resin Systems: Part B", by T. D. Chang et al., Polym. Eng. Sci. 22:1213-1220 (1982).
Org. Coatings & App. Polym. Sci., Proc. (ACS), 48(1), 116-120 (1983) by R. L. Levy and D. P. Ames.
Wang et al., ACS Polym. Mater. Sci. Eng. Prac., 49:138 (1983).
A. Gupta et al., J. Appl. Polym. Sci., 28:1011 (1983).
"Nitroxide Spin Labeling of Epoxy Resins", by I. M. Brown & T. C. Sandreczki, Macromolecules, 16:1890-1895 (1983).
"Substitution Effects in Property Relations for Stepwise Polyfunctional Polymerization", by D. R. Miller, Macromolecules, 13:1063-1069 (1980).
"Curing of Epoxy Resins. I", by K. Dusek & M. Ilavsky, J. Polym. Sci. Symp., 53:29-44 (1975).
"A New Derivation of Post Gel Properties of Network Polymers", by D. R. Miller et al., Macromolecules, 9:206-211 (1976).
"Structure of Diepoxide-Diamine Network Polymers. I.", by J. M. Charlesworth, J. Polym. Phys., 17:1557-1569 (1979).
"A Critical Compilation of Substituent Constants", by N. B. Chapman and J. Shorter, Correlation Analysis in Chemistry, 457, Plenum Press, Burkus et al., J. Am. Chem. Soc., 80:5948 (1958).
Barbalata et al., European Polymer J., 14:427 (1978).
Ferstanding et al., J. Am. Chem. Soc., 81:4838 (1959).
Johnson L.
Lacey David L.
University of Connecticut
LandOfFree
Fluorescene technique to monitor cure in polymers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fluorescene technique to monitor cure in polymers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluorescene technique to monitor cure in polymers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2034206