Fluidic interconnect structures

Details Fluidic interconnect structures Fluidic interconnect structures

2002-04-30

2004-03-09

Vo, Anh T. N. (Department: 2861)

Incremental printing of symbolic information

Ink jet

Fluid or fluid source handling means

Reexamination Certificate

active

06702434

ABSTRACT:

BACKGROUND OF THE DISCLOSURE
Needle septum fluid interconnects have been employed in inkjet printing systems. These interconnects have used a molded elastomeric septum placed below a rigid chamber in which are placed a small metallic ball and a helical compression spring. A slit in the septum forms an opening for a side-hole needle to penetrate. A crimp sleeve held the septum in place.
Slitting the septum causes micro-tearing in the septum material, causing high stress when the septum is penetrated by the needle. When the needle is engaged, the ink can contact the septum, and can attack the high stress areas of the septum, leading to possible material property degradation and material set. Slitting the septum can result in jagged coarse surfaces. As the needle engages the septum, it can scrape septum material away, introducing small particles into the ink and thus contaminating the ink.
SUMMARY OF THE DISCLOSURE
A septum structure includes a septum body structure fabricated of a resilient material. The body structure includes an opening formed there through and a first seal surface circumscribing the opening to engage against a needle when inserted into the opening. The body structure further includes a second seal surface for engaging against a stopper structure assembled with the seal septum when the needle is not inserted into the opening. The septum structure can be over-molded on a rigid host part, or fabricated as a separate structure from the host part, and pressed in to place. Other embodiments are disclosed.


REFERENCES:
patent: 4516967 (1985-05-01), Kopfer
patent: 5721576 (1998-02-01), Barinaga
patent: 5815182 (1998-09-01), Otis et al.
patent: 5895383 (1999-04-01), Niedospial, Jr.
patent: 6130695 (2000-10-01), Childers et al.
patent: 6273562 (2001-08-01), Deshmukh

Affiliated with

Also associated with

Rating

Fluidic interconnect structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluidic interconnect structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluidic interconnect structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3256780