Fluidic heterogeneous microsystems assembly and packaging

Details Fluidic heterogeneous microsystems assembly and packaging Fluidic heterogeneous microsystems assembly and packaging

2006-03-14

2009-12-01

Pert, Evan (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S026000, C257SE21499

Reexamination Certificate

active

07625780

ABSTRACT:
Self-assembly of components carried in a fluid is provided. A first component and a second component are obtained and self-assembled together. A third component is obtained and assembled with the first and second components, following the step of assembling the first and second components. The first, second and third components are all different types of components.

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