Fluidic feedback-controlled liquid cooling module

Details Fluidic feedback-controlled liquid cooling module Fluidic feedback-controlled liquid cooling module

1997-05-16

1998-09-29

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361689, 361704, 361717, 361718, 257714, 257716, 174 151, 174 161, 174 163, 165 804, H05K 720

Patent

active

058153705

ABSTRACT:
A liquid cooling module for cooling electronic circuit components and the like comprises the use of a fluidic amplifier element in conjunction with a thermally sensitive fluidic element. The thermally sensitive fluidic element responds to the change in viscosity with respect to temperature of a coolant flowing through a cooling plate. In response to the viscosity change, the thermally sensitive element produces a fluidic control signal to the fluidic amplifier element, which increases the rate of flow through the cooling plate with increasing coolant temperature and decreases the rate of flow through the cooling plate with decreasing coolant temperature.

REFERENCES:
patent: 3999105 (1976-12-01), Archey et al.
patent: 5050037 (1991-09-01), Yamamoto et al.
patent: 5190099 (1993-03-01), Mon
patent: 5469331 (1995-11-01), Conway et al.
patent: 5550436 (1996-08-01), Kesel
AiResearch Final Report 76-411546 dated Oct. 19, 1976, "Program to Design, Fabricate, Test, and Deliver a Thermal Control-Mixing Control Device for George C. Marshall Space Flight Center National Aeronautics & Space Administration (Contract No. NAS3-31289)".

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