Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate
2011-07-12
2011-07-12
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Interconnecting plural devices on semiconductor substrate
C264S319000, C435S180000, C359S576000
Reexamination Certificate
active
07977122
ABSTRACT:
A micro fluidic device comprises a laminate structure, comprising a plurality of individual layers. At least one layer comprises a micro fluidic channel structure and at least on one side of said layer a further layer is arranged comprising a three-dimensional (3D) micro structure such that the 3D micro structure is influencing a flow characteristic of a fluid within the micro fluidic channel structure.
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Effenhauser Carlo
Sandoz Roger
Dinsmore & Shohl LLP
Lindsay, Jr. Walter L
Pompey Ron
Roche Diagnostics Operations Inc.
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