Fluidic cooling systems and methods for electronic components

Details Fluidic cooling systems and methods for electronic components Fluidic cooling systems and methods for electronic components

2006-07-18

2006-07-18

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S714000, C165S080400, C174S015100

Reexamination Certificate

active

07079393

ABSTRACT:
A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

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