Fluid property sensors incorporating plated metal rings for impr

Details Fluid property sensors incorporating plated metal rings for impr Fluid property sensors incorporating plated metal rings for impr

1994-06-23

1996-12-03

Chilcot, Richard

Measuring and testing

Volume or rate of flow

Thermal type

73 2342, G01F 168

Patent

active

055810284

ABSTRACT:
A semiconductor flow sensor provides a self-aligning seal between the sensor and a manifold carrying the fluid being measured. The sensor includes a sensing element and a semiconductor body having a fluid flow region formed therein. The sensing element crosses through a portion of the flow region and is supported by the semiconductor body. A characteristic of the fluid flowing through the flow region is measured by operation of the sensing element. A sealing ring integrally disposed on the semiconductor body surrounds the flow region and further provides a seal between the sensor and a manifold. To ensure accurate placement of the sealing ring with respect to the sensing element, the sealing ring is electroplated to the semiconductor body prior to formation of the flow region. A pressure and temperature stable seal between the sensor and the manifold is achieved by either compression of the sealing ring, or solder bonding of the sealing ring to the manifold. The direction of fluid flow relative to the flow sensor is either perpendicular or parallel to a plane formed by the sensor.

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