Fluid overfill probe with thermal stress prevention

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

Reexamination Certificate

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C250S573000, C250S576000, C073S29000R, C073S293000

Reexamination Certificate

active

07838859

ABSTRACT:
A fluid overfill probe is resistant to failure caused by physical stresses resulting from thermal expansion of probe components. A fluid level detector is connected to circuit components that are mounted on a circuit board located in a housing of the probe. The circuit board is located within a tube that is positioned within, and secured to the housing, and the circuit board is secured to an inner surface of the tube along its edges. The tube has a shape and rigidity sufficient to maintain a gap between the circuit components and the inner surface of the tube such that thermal expansion of probe components result in no physical stress to the circuit components.

REFERENCES:
patent: 4245188 (1981-01-01), Rottmar
patent: 5889284 (1999-03-01), Mattis
patent: 6363784 (2002-04-01), Gregory
patent: 6443632 (2002-09-01), Ando et al.
patent: 6790473 (2004-09-01), Papathomas et al.
patent: 6806509 (2004-10-01), Yoshino et al.
patent: 7262082 (2007-08-01), Lin et al.
patent: 7285446 (2007-10-01), Shibata
patent: 2008/0107151 (2008-05-01), Khadkikar et al.
patent: 2008/0144033 (2008-06-01), Milo

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