Fluid flow sensor and method of fabricating the same

Details Fluid flow sensor and method of fabricating the same Fluid flow sensor and method of fabricating the same

2002-03-28

2004-07-27

Deb, Anjan K. (Department: 2858)

Electricity: measuring and testing

Determining nonelectric properties by measuring electric...

C073S861080, C073S204220

Reexamination Certificate

active

06768291

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a fluid flow sensor and a method of fabricating the same fabricated by a semiconductor process.
BACKGROUND OF THE INVENTION
One type of a conventional thermal fluid flow sensor for use in detecting flow amount of air is disclosed in U.S. Pat. No. 5,404,753 (JP-A-6-50783). In this thermal fluid flow sensor, a thin film semiconductor flow detecting part and a bonding pad (conductor part) are provided on the same plane and separated from each other by a separation wall. As a result, it is not possible to reduce the planar size of the fluid flow sensor.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a fluid flow sensor capable of reducing its planar size and a method of fabricating the same.
In one of preferred embodiments, a fluid flow sensor comprises a fluid flow sensor chip that includes a board and detecting portions formed on a first surface of the board for detecting a flow rate of fluid flowing above the first surface of the board. The fluid flow sensor chip further includes a substrate conductor portion electrically connected to the detecting portions and formed on a surface other than the first surface.
In fabricating the fluid flow sensor, thin film layers are formed above the first surface of the board, and a hollow cavity portion is formed by etching the board from the side of a second surface of the board opposite the first surface. A through hole is formed in the board where the hollow cavity portion is not formed. A conductor is formed on an inner wall face of the through hole to form a substrate conductor portion on the side of the second surface of the board.


REFERENCES:
patent: 4548078 (1985-10-01), Bohrer et al.
patent: 5198773 (1993-03-01), Latta
patent: 5404753 (1995-04-01), Hecht et al.
patent: 5591321 (1997-01-01), Pyke
patent: 6300753 (2001-10-01), Walde et al.

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