Fluid flow control plates for hot melt adhesive applicator

Fluid sprinkling – spraying – and diffusing – With system fluid relief or return to supply

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Details

239391, 239562, B05B 100

Patent

active

058234373

ABSTRACT:
A system usable for dispensing fluids including hot melt adhesives supplied from a reservoir onto a substrate. The system includes a fluid metering device having a plurality of metered fluid outlets for supplying fluid from the reservoir, a main manifold having an end portion with plurality of fluid outlet ports coupled to corresponding metered fluid outlets of the fluid metering device, and a corresponding plurality of fluid return ports coupled to the reservoir. At least one individual fluid flow control plate having a plate fluid inlet port on a plate fluid interface is mountable on the end portion of the main manifold to couple the plate fluid inlet port of the individual fluid flow control plate to a corresponding one of the plurality of fluid outlet ports of the main manifold. The individual fluid flow control plate includes a plate fluid outlet port coupled to the plate fluid inlet port by a plate fluid flow conduit for either recirculating back to the main manifold or directing the fluid to a fluid dispensing nozzle.

REFERENCES:
patent: 4983109 (1991-01-01), Miller et al.
patent: 5000112 (1991-03-01), Rothen et al.
patent: 5620139 (1997-04-01), Ziecker
patent: 5683037 (1997-11-01), Rochman et al.

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