Fluid-filled and gas-filled semiconductor packages

Details Fluid-filled and gas-filled semiconductor packages Fluid-filled and gas-filled semiconductor packages

1993-10-26

1995-04-11

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 437215, 437216, 437219, H01L 2160

Patent

active

054058082

ABSTRACT:
Improved thermal and/or electrostatic discharge characteristics are realized in cavity-type semiconductor device assemblies by filling the cavity with either a thermally conductive fluid and/or an arc suppressing gas, or combinations thereof. The interior of the cavity, including the die, leads extending into the cavity, and connections between the die and the leads may be coated to provide protection from corrosive and/or electrical characteristics of the cavity-filling fluid (liquid or gas). The fluid may be introduced through a hole in a lid sealing the cavity, and the cavity is filled sufficiently that the fluid is in contact with the die at various spatial orientations of the package. A thermally-conductive fluid substantially filling the cavity provides improved thermal conduction from the die to the package body without the mechanical stress problems (e.g., thermally induced cracking) ordinarily associated with bonding solid materials to the die. An arc-suppressing gas filling the cavity provides significant suppression of electrical discharges, thereby producing a packaged semiconductor device with improved electrostatic characteristics.

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