Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet
Reexamination Certificate
2007-03-13
2010-11-23
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Fluid pattern dispersing device making, e.g., ink jet
C347S047000
Reexamination Certificate
active
07836600
ABSTRACT:
A method of forming a fluid chamber and a source of fluid impedance includes providing a substrate having a surface; depositing a first material layer on the surface of the substrate, the first material layer being differentially etchable with respect to the substrate; removing a portion of the first material layer thereby forming a patterned first material layer and defining the fluid chamber boundary location; depositing a sacrificial material layer over the patterned first layer; removing a portion of the sacrificial material layer thereby forming a patterned sacrificial material layer and further defining the fluid chamber boundary location; depositing at least one additional material layer over the patterned sacrificial material layer; forming a hole extending from the at least one additional material layer to the sacrificial material layer, the hole being positioned within the fluid chamber boundary location; removing the sacrificial material layer in the fluid chamber boundary location by introducing an etchant through the hole; forming the fluid chamber by introducing an etchant through the hole; and forming a source of fluid impedance.
REFERENCES:
patent: 3765969 (1973-10-01), Kragness et al.
patent: 4580149 (1986-04-01), Domoto et al.
patent: 4847630 (1989-07-01), Bhaskar et al.
patent: 5278585 (1994-01-01), Karz et al.
patent: 5502471 (1996-03-01), Obermeier et al.
patent: 5760804 (1998-06-01), Heinzl et al.
patent: 5841452 (1998-11-01), Silverbrook
patent: 6019457 (2000-02-01), Silverbrook
patent: 6102530 (2000-08-01), Kim et al.
patent: 6183067 (2001-02-01), Matta
patent: 6273553 (2001-08-01), Kim et al.
patent: 6478408 (2002-11-01), Lee et al.
patent: 6499832 (2002-12-01), Lee et al.
patent: 6676244 (2004-01-01), Kwon et al.
patent: 6751865 (2004-06-01), Peeters et al.
patent: 7487590 (2009-02-01), Song et al.
patent: 2002/0075359 (2002-06-01), Wuu et al.
patent: 2003/0160842 (2003-08-01), Min et al.
patent: 2004/0000051 (2004-01-01), Silverbrook
patent: 2006/0027521 (2006-02-01), Kneezel et al.
patent: 2007/0144004 (2007-06-01), Silverbrook
patent: 2008/0016689 (2008-01-01), Horn et al.
patent: 1 112 848 (2001-07-01), None
patent: 1 413 439 (2004-04-01), None
patent: 55 121080 (1980-09-01), None
S.S. Baek, H.T.Lim, H. Song, Y.S. Kim, K.D.Bae, C.H. Cho, C.S. Lee, J.W. Shin, S.J. Shin, K. Kuk and Y.S. Oh, “T-Jet: A Novel Thermal Inkjet Printhead With Monolithically Fabricated Nozzle Plate on Soi Water”, Jun. 12, 2003, pp. 472-475, XP002356682.
Chwalek James M.
Delametter Christopher N.
Kneezel Gary A.
Lebens John A.
Trauernicht David P.
Angwin David P
Eastman Kodak Company
Tugbang A. Dexter
Zimmerli William R.
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