Fluid ejection head assembly

Details Fluid ejection head assembly Fluid ejection head assembly

2007-03-13

2007-03-13

Meier, Stephen (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S040000, C347S041000, C347S049000

Reexamination Certificate

active

10769429

ABSTRACT:
A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

REFERENCES:
patent: 4942408 (1990-07-01), Braun
patent: 5027134 (1991-06-01), Harmon et al.
patent: 5498306 (1996-03-01), Shibata
patent: 6068364 (2000-05-01), Kusumi et al.
patent: 6168255 (2001-01-01), Nagashima
patent: 6302512 (2001-10-01), Ikegame
patent: 6471330 (2002-10-01), Umeda et al.
patent: 6481826 (2002-11-01), Hara et al.
patent: 2002/0027577 (2002-03-01), Sugiyama et al.
patent: 2002/0093552 (2002-07-01), Yamamoto
patent: 2004/0001117 (2004-01-01), Choy et al.
patent: 2004/0021729 (2004-02-01), Verlinden et al.
patent: 0 995 601 (2000-04-01), None
patent: 1 179 430 (2002-02-01), None
patent: 1177897 (2002-02-01), None
patent: WO 03/070471 (2003-08-01), None

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