Fluid ejection device with compressive alpha-tantalum layer

Details Fluid ejection device with compressive alpha-tantalum layer Fluid ejection device with compressive alpha-tantalum layer

2005-05-17

2005-05-17

Meier, Stephen D. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

06893116

ABSTRACT:
A fluid ejection device is disclosed. The fluid ejection device may include a substrate including a heating element and a passivation layer in contact with the heating element. The fluid ejection device may further include a buffer layer in contact with the passivation layer and a compressive alpha-tantalum layer in contact with, and lattice matched to, the buffer layer.

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Hilke Donohue, et al. “Low-resistivity PVD a-tantalum: Phase formation and integration in ultra-low K dielectric/copper damascene structures”.
D. Fischer, et al.; “Barrier and Contact Behavior of Tantalum Based Thin Films for Use in Copper Metallization Scheme”.

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