Fluid ejection device and method of fabricating the same

Etching a substrate: processes – Forming or treating thermal ink jet article

Reexamination Certificate

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Details

C216S002000, C216S033000, C216S036000, C216S056000, C216S079000, C216S099000, C029S890100, C438S021000

Reexamination Certificate

active

10980958

ABSTRACT:
A fluid ejection device includes a first substrate having a first crystal orientation, a second substrate having a second crystal orientation, bound to the first substrate, a manifold through the first and second substrates, a chamber formed in the second substrate, connected with the manifold, and a plurality of nozzles connecting to the chamber, wherein the first crystal orientation is different from the second crystal orientation. A method of fabricating the same is also disclosed.

REFERENCES:
patent: 4875968 (1989-10-01), O'Neill et al.
patent: 4878957 (1989-11-01), Yamaguchi et al.
patent: 5441600 (1995-08-01), Smits
patent: 6033581 (2000-03-01), Kobayashi
patent: 6273553 (2001-08-01), Kim et al.
patent: 6449831 (2002-09-01), Komplin et al.
patent: 6883903 (2005-04-01), Truninger et al.
patent: 07335511 (1995-12-01), None

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