Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-03-06
2007-03-06
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S002000, C216S033000, C216S036000, C216S056000, C216S079000, C216S099000, C029S890100, C438S021000
Reexamination Certificate
active
10980958
ABSTRACT:
A fluid ejection device includes a first substrate having a first crystal orientation, a second substrate having a second crystal orientation, bound to the first substrate, a manifold through the first and second substrates, a chamber formed in the second substrate, connected with the manifold, and a plurality of nozzles connecting to the chamber, wherein the first crystal orientation is different from the second crystal orientation. A method of fabricating the same is also disclosed.
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Chen Wei-Lin
Hu Hung-Sheng
Alanko Anita
Benq Corporation
Thomas Kayden Horstemeyer & Risley
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