Fluid-ejection assembly

Incremental printing of symbolic information – Ink jet – Ejector mechanism

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C347S029000, C347S039000, C347S033000, C347S035000

Reexamination Certificate

active

07086716

ABSTRACT:
A fluid-ejection assembly of one embodiment is disclosed comprising first and second arrays of fluid-ejection mechanisms, first and second service stations, and first and second drive mechanisms. The first array ejects fluid onto media; the first service station is to service the first array. The second array ejects fluid onto the media; the second service station is to service the second array. The first drive mechanism moves the first array between a first position to eject fluid onto the media and a second position at the first service station, while the second array ejects fluid onto the media in place of the first array. The second drive mechanism moves the second array between a third position to eject fluid onto the media and a fourth position at the second service station while the first array ejects fluid onto the media in place of the second array.

REFERENCES:
patent: 5398053 (1995-03-01), Hirosawa et al.
patent: 5587730 (1996-12-01), Karz
patent: 5838343 (1998-11-01), Chapin et al.
patent: 5984455 (1999-11-01), Anderson
patent: 6076910 (2000-06-01), Anderson
patent: 6244688 (2001-06-01), Hickman
patent: 6364451 (2002-04-01), Silverbrook
patent: 6467887 (2002-10-01), Lopez et al.
patent: 6536883 (2003-03-01), Hawkins et al.
patent: 6783209 (2004-08-01), Gompertz
patent: 2002/0163549 (2002-11-01), Anderson et al.
patent: 2000218884 (2000-08-01), None
patent: 2002-059559 (2002-02-01), None
patent: 2002059559 (2002-02-01), None
patent: WO/03074277 (2003-09-01), None
European Search Report dated Feb. 16, 2005. DeGroot, R, Ep 04 25 5774.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fluid-ejection assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluid-ejection assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluid-ejection assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3709591

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.