Fluid diode expansion device for heat pumps

Refrigeration – Refrigeration producer – Compressor-condenser-evaporator circuit

Reexamination Certificate

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Details

C062S527000, C138S040000

Reexamination Certificate

active

07043937

ABSTRACT:
An expansion device for the heat pump applications consists of a flow resistance device that has a different resistance to refrigerant flow depending on the flow direction through this device. The flow resistance device has no moving parts so that it avoids the damage, wear and contamination problems of the moveable piston in the prior art. The flow resistance device is a fixed obstruction about which the fluid must flow when traveling through the expansion device.

REFERENCES:
patent: 4255940 (1981-03-01), Grahl et al.
patent: 4548047 (1985-10-01), Hayashi et al.
patent: 4593881 (1986-06-01), Yoshino
patent: 4779428 (1988-10-01), Chan et al.
patent: 4873838 (1989-10-01), Voorhis et al.
patent: 4876859 (1989-10-01), Kitamoto
patent: 4978062 (1990-12-01), Lange, Sr.
patent: 5004008 (1991-04-01), Drucker
patent: 5038580 (1991-08-01), Hart
patent: 5085058 (1992-02-01), Aaron et al.
patent: 5345780 (1994-09-01), Aaron et al.
patent: 5564282 (1996-10-01), Kaye
patent: 5689972 (1997-11-01), Schuster et al.
patent: 5715862 (1998-02-01), Palmer
patent: 5749239 (1998-05-01), Pomme
patent: 5808209 (1998-09-01), Zielinska et al.
patent: 5875637 (1999-03-01), Paetow
patent: 5966960 (1999-10-01), Cummings et al.
patent: 6047556 (2000-04-01), Lifson
patent: 6199399 (2001-03-01), Voorhis
patent: 6206652 (2001-03-01), Caillat
patent: 6314753 (2001-11-01), Hirota et al.
patent: 6532764 (2003-03-01), Hirota et al.
patent: 408075327 (1996-03-01), None
patent: WO 000052371 (2000-09-01), None
Drawing Diagram Figure 1—Prior Art.
Robert W. Fox and Alan T. McDonald, Introduction to Fluid Mechanics, 1973, pp. 371, table, 368, & 428, John Wiley & Sons Inc., Canada.
Compsys-Dynamic Simulation Of Gas Compression Plants, S.A.T.E., monocomp.DOC, Jun. 12, 2002, Systems and Advanced Technologies Enngineering S.r.I., Santa Croce 664/A, Venice Italy.
Refrigeration Scroll For Parallel Applications, download from www.ecopeland.com, Feb. 26, 2002, pp. 1-7, Europe.
Search Report PCT/US05/03731

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