Fluid device connecting structure

Pipe joints or couplings – Packed – Flanged pipe

Reexamination Certificate

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Details

C285S112000, C285S336000

Reexamination Certificate

active

08033579

ABSTRACT:
For simply and reliably coupling first and second fluid devices, a fluid device connecting structure is arranged to couple first and second connection parts of the first and second fluid devices by use a coupling member by placing a resin seal member in seal grooves formed in the connection parts. The first connection part includes a first mounting groove for attachment jig and a first fitting groove provided between the first mounting groove and an end face of the first connection part to receive the coupling member. The second connection part includes a second mounting groove for the jig and a second fitting groove provided between the second mounting groove and an end face of the second connection part to receive the coupling member. The coupling member includes a plurality of split members each including a first projecting portion held in contact with an end-face-side inside surface of the first fitting groove and a second projecting portion held in contact with an end-face-side inside surface of the second fitting groove, the first and second projecting portions being arranged at a predetermined distance.

REFERENCES:
patent: 1362784 (1920-12-01), Cooper
patent: 1928122 (1933-09-01), Bennett
patent: 2338006 (1943-12-01), Morehouse
patent: 3141685 (1964-07-01), Watts
patent: 4202568 (1980-05-01), Strom
patent: 4795197 (1989-01-01), Kaminski et al.
patent: 5018768 (1991-05-01), Palatchy
patent: 5377940 (1995-01-01), Cabe et al.
patent: 5466018 (1995-11-01), Stobbart
patent: 5947533 (1999-09-01), Fisher et al.
patent: 6070912 (2000-06-01), Latham
patent: 6709212 (2004-03-01), Lauchner
patent: 7581764 (2009-09-01), Ishihara
patent: 2005/0212291 (2005-09-01), Edwards
patent: U-60-29992 (1985-02-01), None
patent: A-2002-161992 (2002-06-01), None
patent: A-2004-197826 (2004-07-01), None
patent: A-2006-064080 (2006-03-01), None
patent: A-2006-144948 (2006-06-01), None
Japanese Office Action issued on Nov. 10, 2009 in Japanese Patent Application No. 2008-180545 (with translation).

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