Fluid-cooled integrated circuit package

Details Fluid-cooled integrated circuit package Fluid-cooled integrated circuit package

1986-03-31

1988-07-19

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 357 82, H02B 100

Patent

active

047589264

ABSTRACT:
A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips.

REFERENCES:
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4381818 (1983-05-01), Sachar et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4573067 (1986-02-01), Tuckerman et al.
patent: 4631636 (1986-12-01), Andrews
patent: 4639829 (1987-01-01), Ostergren et al.
"Tiny Channels Take Heat From Multichip Modules", by Jerry Lyman, Electronics, May 12, 1986.

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