Fluid cooled electronics module cover

Details Fluid cooled electronics module cover Fluid cooled electronics module cover

2008-12-09

2011-12-20

Thomas, Bradley (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679530, C361S699000, C361S717000, C165S104330, C174S015100, C257S712000

Reexamination Certificate

active

08081478

ABSTRACT:
An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that is configured to make thermal contact with heat-generating electronic components of a module. The module cover includes an inlet, an outlet and at least one fluid passageway between the inlet and the outlet. The fluid passageway permits fluid to flow through the module cover, thereby allowing the module cover to act as a heat sink.

REFERENCES:
patent: 3921201 (1975-11-01), Eisele et al.
patent: 4962444 (1990-10-01), Niggemann
patent: 5023695 (1991-06-01), Umezawa et al.
patent: 5050037 (1991-09-01), Yamamoto et al.
patent: 5126829 (1992-06-01), Daikoku et al.
patent: 5157588 (1992-10-01), Kim et al.
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5177666 (1993-01-01), Bland et al.
patent: 5177667 (1993-01-01), Graham et al.
patent: 5183104 (1993-02-01), Novotny
patent: 5239200 (1993-08-01), Messina et al.
patent: 5249100 (1993-09-01), Satoh et al.
patent: 5294830 (1994-03-01), Young et al.
patent: 5323292 (1994-06-01), Brzezinski
patent: 5463528 (1995-10-01), Umezawa
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5705850 (1998-01-01), Ashiwake et al.
patent: 5761035 (1998-06-01), Beise
patent: 5831824 (1998-11-01), McDunn et al.
patent: 5841634 (1998-11-01), Visser
patent: 5978220 (1999-11-01), Frey et al.
patent: 6026565 (2000-02-01), Giannatto et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6236566 (2001-05-01), Regnier et al.
patent: 6292364 (2001-09-01), Fitzgerald et al.
patent: 6305463 (2001-10-01), Salmonson
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6366462 (2002-04-01), Chu et al.
patent: 6392891 (2002-05-01), Tzlil et al.
patent: 6535386 (2003-03-01), Sathe et al.
patent: 6578626 (2003-06-01), Calaman et al.
patent: 6594149 (2003-07-01), Yamada et al.
patent: 6621706 (2003-09-01), Tzlil et al.
patent: 6661658 (2003-12-01), Capriz et al.
patent: 6662859 (2003-12-01), Strahle et al.
patent: 6719039 (2004-04-01), Calaman et al.
patent: 6721181 (2004-04-01), Pfeifer et al.
patent: 6882533 (2005-04-01), Bash et al.
patent: 6935412 (2005-08-01), Mueller
patent: 6942019 (2005-09-01), Pikovsky et al.
patent: 6986382 (2006-01-01), Upadhya et al.
patent: 6988534 (2006-01-01), Kenny et al.
patent: 6992382 (2006-01-01), Chrysler et al.
patent: 7035104 (2006-04-01), Meyer
patent: 7040383 (2006-05-01), Oyamada
patent: 7262966 (2007-08-01), Liao
patent: 7352581 (2008-04-01), Tomioka
patent: 7372697 (2008-05-01), Tomioka
patent: 7417857 (2008-08-01), Rondier et al.
patent: 7450384 (2008-11-01), Tavassoli et al.
patent: 7460367 (2008-12-01), Tracewell et al.
patent: 7486518 (2009-02-01), Tomioka
patent: 7602610 (2009-10-01), Ueda
patent: 7652885 (2010-01-01), Tomioka
patent: 7830664 (2010-11-01), Campbell et al.
patent: 2002/0067598 (2002-06-01), Sathe et al.
patent: 2003/0178179 (2003-09-01), Brost
patent: 2004/0012914 (2004-01-01), Chu et al.
patent: 2004/0069451 (2004-04-01), Meyer
patent: 2006/0096738 (2006-05-01), Kang et al.
patent: 2006/0232939 (2006-10-01), Inoue
patent: 2007/0091569 (2007-04-01), Campbell et al.
patent: 2007/0097627 (2007-05-01), Taylor et al.
patent: 2008/0264604 (2008-10-01), Campbell et al.
patent: 2008/0315403 (2008-12-01), Andry et al.
patent: 2009/0040726 (2009-02-01), Hoffman et al.
patent: 2009/0219695 (2009-09-01), Tomioka

Affiliated with

Also associated with

Rating

Fluid cooled electronics module cover does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluid cooled electronics module cover, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluid cooled electronics module cover will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4308729