Fluid-containing cooling plate for an electronic component

Details Fluid-containing cooling plate for an electronic component Fluid-containing cooling plate for an electronic component

2007-12-11

2007-12-11

Duong, Tho (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S170000, C165S104210

Reexamination Certificate

active

10883450

ABSTRACT:
A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

REFERENCES:
patent: 1549619 (1925-08-01), Steenstrup
patent: 2348020 (1944-05-01), Norris
patent: 3476175 (1969-11-01), Plevyak
patent: 4971144 (1990-11-01), Gibson et al.
patent: 5390732 (1995-02-01), Bathla
patent: 2001/0030043 (2001-10-01), Gleisle et al.
patent: 2002/0179288 (2002-12-01), Ishida et al.
patent: 2004/0011512 (2004-01-01), Noda et al.
patent: 4438393 (1996-05-01), None
patent: WO 8403354 (1984-08-01), None

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