Flow-through ion beam source

Coating apparatus – Gas or vapor deposition – With treating means

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156345, 1566431, C23C 1600

Patent

active

056016549

ABSTRACT:
A method and an apparatus for forming a charge neutral ion beam which is useful in producing thin films of material on electrically conductive or non-conductive substrates are provided.

REFERENCES:
patent: 3895602 (1975-07-01), Bobenrieth
patent: 4250009 (1981-02-01), Cuomo et al.
patent: 4381453 (1983-04-01), Cuomo et al.
patent: 4457803 (1984-07-01), Takigawa
patent: 4481062 (1984-11-01), Kaufman et al.
patent: 4541890 (1985-09-01), Cuomo et al.
patent: 4637869 (1987-01-01), Glocker et al.
patent: 4673475 (1987-06-01), Windischmann
patent: 4731540 (1988-03-01), Schmidt
patent: 5108535 (1992-04-01), Ono et al.
patent: 5342448 (1994-08-01), Hamamura et al.
patent: 5342660 (1994-08-01), Cann et al.
patent: 5346600 (1994-09-01), Nieh et al.
patent: 5455081 (1995-10-01), Okada et al.
patent: 5462629 (1995-10-01), Kubota et al.
patent: 5462635 (1995-10-01), Ono et al.
patent: 5498290 (1996-03-01), Matossian et al.
Kaufman, Harold R., "Technology of Ion Beam Sources Used in Sputtering," Journal of Vacuum Science Technology, 15(2) Mar./Apr. 1978, pp. 272-276.
Singer, Peter, ed., "Filling Contacts and Vias: A Progress Report," Semiconductor International, Feb. 1996, pp. 89-94.
Rossnagel, S. M., "Ionized Magnetron Sputtering for Lining and Filling Trenches and Vias," Semiconductor International, Feb. 1996, pp. 99-102.

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